| 摘要 |
A semiconductor device includes a wiring substrate (12) having first (124) and second (125) connection pads on a main surface thereof, a first semiconductor chip (14) having first electrode pads (141), a second semiconductor chip (16) having second electrode pads (161) each of which has a size smaller than that of each of the first electrode pads (141), first wires (22) connecting the first electrode pads (141) with the first connection pads(124), and second wires (24) connecting the second electrode pads (161) with the second connection pads (125). The second wires (24) have wide width parts at first ends (241). The wide width parts (241) are connected the second connection pads (125) and the second wires (24) have second ends connected to the second electrode pads (161) via bump electrodes (30) which are smaller than the second electrode pads (161). |
