| 摘要 |
PROBLEM TO BE SOLVED: To provide a supporting apparatus and a supporting method of a semiconductor wafer capable of properly supporting the whole of the semiconductor wafer even if the wafer has a non-flat surface shape. SOLUTION: Even if a bump forming region R1 and a bump non-forming region R2 are different in surface position in a wafer W, an inner table 2 and an outer table 3 are relatively moved conforming to its step. Thus, the whole of the wafer W can be supported, and even if the wafer W is pressed by a heating roller R when a die attach film S is pasted, the warpage of the wafer W is suppressed and a bonding failure such as air catch can be prevented. COPYRIGHT: (C)2010,JPO&INPIT |
