发明名称
摘要 PROBLEM TO BE SOLVED: To reduce contamination of a wafer to improve sealing performance of a heating container. SOLUTION: A heat treatment apparatus includes: a container of airtight structure; a substrate holding means which holds a substrate placed in the container; a lamp unit to heat the substrate through a top wall of the container; a cylindrical external rotor which is provided in outer circumference of the container and rotates around a vertical axis of the container; a cylindrical internal rotor which is fit in the container and rotates the substrate holding means in a coaxial manner with the external rotor; a magnetic coupling means which magnetically couples the external rotor with the internal rotor through the side wall of the container to rotate the internal rotor by the external rotor; and a gas bearing which feeds a gas to the internal rotor so as to float and support the internal rotor. The magnetic coupling means includes a magnet disposed in the external rotor and a magnetic body provided in the internal rotor, and the top side of the magnet disposed in the external rotor is held higher than the top side of the magnetic body provided in the internal rotor, when rotating the substrate holding means. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5143180(B2) 申请公布日期 2013.02.13
申请号 JP20100099816 申请日期 2010.04.23
申请人 发明人
分类号 H01L21/26;H01L21/683 主分类号 H01L21/26
代理机构 代理人
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