| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method of manufacturing an insulating circuit board, wherein no brazing material sticks on a circuit surface and a metal board and a ceramic substrate are reliably joined; the insulating circuit board; and a substrate for a power module. SOLUTION: In the method of manufacturing the insulating circuit board having the metal circuit board 7 brazed to the surface of the ceramic substrate 6, pressure at the peripheral edge of the metal circuit board 7 is made higher than that at a center portion inside the peripheral edge when the metal circuit board 7 is stacked on the surface of the ceramic substrate 6 with a brazing material 15 interposed and they are pressed in the stacking direction. COPYRIGHT: (C)2010,JPO&INPIT |
