SEMICONDUCTOR PACKAGE USING A REDISTRIBUTION SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package using a rewiring substrate and a manufacturing method thereof are provided to improve the reliability of the semiconductor package by mounting a light receiving area of an image sensor chip to face a through hole on a package substrate and minimizing the contamination of the image sensor chip. CONSTITUTION: A package substrate(110) includes a pair of through holes(112) which are separated. A circuit pattern(120) is formed on one side of the package substrate. A pad(130) is formed on one side of the package substrate to be connected to the circuit pattern. A pair of image sensor chips(140) are mounted on one side of the package substrate. A dam(150) is interposed between one side of the package substrate and an image sensor chip.