LIGHT EMITTING DEVICE AND METHOD FABRICATING THE SAME

摘要

PURPOSE: A light emitting device and a manufacturing method thereof are provided to reduce threading dislocation density by forming a fluorescent thin film layer with a buried fluorescent pattern on an undoped semiconductor layer. CONSTITUTION: An active layer(120) is contacted with a first conductive semiconductor layer(110). A second conductive semiconductor layer(130) is formed on an opposite surface to a contact surface with the first conductive semiconductor layer. A reflection layer(140) is formed on an opposite surface to a contact surface with the active layer. A support substrate is attached to an opposite surface to a contact surface with the second conductive semiconductor layer. A fluorescent thin film layer is formed by burying a fluorescent pattern in an undoped semiconductor layer.