发明名称 |
Integrated circuit packaging system with stack interconnect and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate base side and a substrate stack side; mounting an integrated circuit over the substrate stack side; attaching a stack connector to the substrate stack side; forming an encapsulation over the stack connector and the integrated circuit; attaching an external connector to the substrate base side; attaching an adhesive tape to the external connector having spacing between the adhesive tape and the substrate base side; cutting a step portion in the encapsulation to expose the stack connector; cutting a singulation kerf in the package substrate having exit damage on the substrate base side; and removing the adhesive tape.
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申请公布号 |
US8372695(B2) |
申请公布日期 |
2013.02.12 |
申请号 |
US20100950631 |
申请日期 |
2010.11.19 |
申请人 |
STATS CHIPPAC LTD.;PARK SANGMI;KIM MINJUNG |
发明人 |
PARK SANGMI;KIM MINJUNG |
分类号 |
H01L21/00;H01L23/28 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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