| 摘要 |
PURPOSE: An inductive coupled type plasma processing apparatus is provided to form a plurality of cutting parts on a lead frame, and to form a closed loop of eddy current, thereby improve plasma generating uniformity inside a chamber. CONSTITUTION: A chamber has a susceptor settling a substrate. A window(220) is separated into a central part corresponding to the center of the substrate, and an edge part corresponding to the edge of the substrate. A lead frame(210) comprises an inner frame part(212) supporting the window central part, an outer frame part(211) supporting the window edge part, and a link frame part(213) connecting the inner frame part and the outer frame part. A first antenna unit(231) is arranged on the upper side of the window central part. A second antenna unit(232) is arranged on the upper side of the window edge part. A cutting unit(214) blocks the generation of eddy current following to the lead frame. |
