发明名称 |
SHOTTKY BARRIER DIODE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: A schottky barrier diode and a manufacturing method thereof are provided to reduce manufacturing costs and to simplify manufacturing processes by not requiring an additional ion implantation process and a heat treatment process. CONSTITUTION: A buffer layer(200) is formed on a substrate(100). An n-GaN layer(300) doped with aluminum is formed on the buffer layer. A GaN layer(400) doped with aluminum is formed on the n-GaN layer doped with aluminum. A first electrode(700) is formed on the GaN layer doped with aluminum. A second electrode(600) is formed on the other side of the substrate with the n-GaN layer doped with aluminum.
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申请公布号 |
KR20130014849(A) |
申请公布日期 |
2013.02.12 |
申请号 |
KR20110076558 |
申请日期 |
2011.08.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JAE HOON |
分类号 |
H01L29/872 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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