发明名称 METHOD FOR PLASMA ENHANCED BONDING AND BONDED STRUCTURES FORMED BY PLASMA ENHANCED BONDING
摘要 An electronic device comprises a substrate (110) comprising a first surface and a second surface, a substrate carrier (105) comprising a first surface and a second surface, and an inorganic material (120) bonding the second surface of the substrate (110) and the second surface of the substrate carrier (105).
申请公布号 KR101232504(B1) 申请公布日期 2013.02.12
申请号 KR20077009917 申请日期 2005.10.04
申请人 发明人
分类号 B41J2/235;B81B7/02;H01L27/02 主分类号 B41J2/235
代理机构 代理人
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