发明名称 |
Semiconductor device and production method thereof |
摘要 |
An object of the present invention is to improve the quality control of a semiconductor device. By forming an inscription comprising a culled or pixel skipping pattern of dimples on the upper surface of a die pad in a QFN, it is possible to confirm the inscription by X-ray inspection or the like even after individuation and specify a cavity of a resin molding die. Further, it is possible to specify the position of a device region in a lead frame. As a result, when a defect appears, it is possible to sort a defective QFN by appearance inspection and improve quality control in the assembly of a QFN.
|
申请公布号 |
US8373258(B2) |
申请公布日期 |
2013.02.12 |
申请号 |
US201113118401 |
申请日期 |
2011.05.28 |
申请人 |
RENESAS ELECTRONICS CORPORATION;MIZUSAKI SHINYA;FUKUHARA KAZUYA |
发明人 |
MIZUSAKI SHINYA;FUKUHARA KAZUYA |
分类号 |
H01L23/495;H01L21/44;H01L21/50;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|