发明名称 |
Light emitting diode package |
摘要 |
A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
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申请公布号 |
US8373180(B2) |
申请公布日期 |
2013.02.12 |
申请号 |
US20070443314 |
申请日期 |
2007.09.21 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD.;KIM HWA JA;KIM NAM YOUNG;LEE MYUNG HEE;HAN KYOUNG BO;KIM TAE KWANG;SO JI SEOP |
发明人 |
KIM HWA JA;KIM NAM YOUNG;LEE MYUNG HEE;HAN KYOUNG BO;KIM TAE KWANG;SO JI SEOP |
分类号 |
H01L33/00;H01L33/48;H01L33/54 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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