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经营范围
发明名称
Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method
摘要
申请公布号
US8372903(B2)
申请公布日期
2013.02.12
申请号
US12849896
申请日期
2010.08.04
申请人
发明人
分类号
C08K0005/005399
主分类号
C08K0005/005399
代理机构
代理人
主权项
地址
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