发明名称 Method for fabrication of a semiconductor device and structure
摘要 Systems and methods are disclosed for fabricating a semiconductor device, includes implanting one or more regions on a semiconductor wafer; performing a layer transfer onto a carrier; and transferring from said carrier to a target wafer.
申请公布号 US8373230(B1) 申请公布日期 2013.02.12
申请号 US20100904114 申请日期 2010.10.13
申请人 MONOLITHIC 3D INC.;OR-BACH ZVI;CRONQUIST BRIAN;BEINGLASS ISREAL;DE JONG JAN LODEWIJK;SEKAR DEEPAK C. 发明人 OR-BACH ZVI;CRONQUIST BRIAN;BEINGLASS ISREAL;DE JONG JAN LODEWIJK;SEKAR DEEPAK C.
分类号 H01L27/12 主分类号 H01L27/12
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