Package for an implantable neural stimulation device

摘要

The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.