| 摘要 |
FIELD: radio engineering.SUBSTANCE: manufacturing method of multilayer printed circuit boards involves assembly into a package of n single- or double-sided printed circuit boards, with plated holes made in them and forming interlayer through connections by means of contact to each other, and n-1 layers of adhesion gaskets; filling of plated holes of circuit boards by means of a filler vulcanised during the pressing process and further vacuum hot pressing of the package. Filler is removed out of through holes after the pressing process is completed.EFFECT: avoiding the occurrence of metal plating defects - occurrence in walls of holes of broken sections when drilling out the resin penetrated into the holes, and thus, cheapening of the manufacturing process of multilayer printed circuit boards at experimental and small-batch production.2 dwg |
