| 摘要 |
A holding device for disc-shaped semiconductor elements on a supporting wheel, particularly a rotating semiconductor device, is disclosed and includes two clamping members between which the semiconductor element is gripped by its end faces. At least one electrical connection is also between the clamping members. The holding device further comprises a resilient member for producing a contact pressure. The clamping members, the semiconductor element and possibly the associated cooling elements are preferably disposed as a fully assembled structural unit in recesses at the outer periphery of the supporting wheel. |
