| 摘要 |
PURPOSE: An apparatus and method for bonding a wire are provided to cope with semiconductor devices with various structures by absorbing and fixing a PCB or a silicon chip attached to the PCB using electrostatic force. CONSTITUTION: A silicon chip is attached to a PCB(20). An electrostatic chuck(12) fixes the silicon chip or PCB with electrostatic force. A base(14) supports the electrostatic chuck and is made of metal materials. A heating unit generates heat in the base. |
