| 摘要 |
<p>PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce an electrical signal transmission path by directly connecting semiconductor chips in a bottom package and a top package by using a wire connection part located on a surface of a molding member. CONSTITUTION: A first semiconductor chip(120) is mounted on a first substrate(110). A first wire part(130) connects a first substrate and the first semiconductor chip. A wire connection part(170) is electrically connected to the first wire part. A second substrate(210) is arranged on the wire connection part. A second semiconductor chip(220) is mounted on the second substrate.</p> |
