| 摘要 |
<p>PURPOSE: A semiconductor package is provided to skip a soldering process by using a wire for electrical connection in a structural connection. CONSTITUTION: A lead frame includes a plurality of pins(110_2). A PCB(120) is electrically connected to a part of the pins. A DCB(Direct Copper Bond)(130) is electrically connected to the relevant part of the PCB. A semiconductor device(150) is installed on the DCB. The lead frame controls the number of the wires and the material of the wire. The wire is made of aluminum.</p> |
