LED CHIP WITH CURVATURE BOARD AND LED PACKAGE USING THE SAME

摘要

PURPOSE: An LED chip with a curved substrate and an LED package using the same are provided to improve internal quantum efficiency by applying tension stress to the LED chip to improve a band structure of a quantum well layer. CONSTITUTION: An n-type semiconductor layer(110) is formed on a substrate(140). An active layer(120) is formed on the n-type semiconductor layer. A p-type semiconductor layer(130) is formed on the active layer. An n-type electrode(160) is formed on the exposed n-type semiconductor layer. A p-type electrode(170) is formed on the p-type semiconductor layer. A flexible part(180) is formed on the lower side of the substrate to generate stress.