Passive Thermal Impedance Matching Using Common Materials

摘要

A device and method for dissipating heat from a source of heat is described. A plurality of layers of thermally conductive materials receives a flow of heat from a source of heat. A first layer of the plurality of layers receives the flow of heat from the source of heat and redirects and transfers the flow of heat to a second of the plurality of layers. Each layer has a separate preselected thermal impedance to control a desired temperature change across the plurality of layers and to maintain a desired operating temperature of the source heat.