BUMP FORMING APPARATUS AND METHOD FOR FORMING BUMP USING THE SAME

摘要

PURPOSE: An apparatus for forming a bump and a method for forming the bump using the same are provided to increase the conductivity of the bump by using various kinds of conductive powder. CONSTITUTION: A support stand(120) supports a bump object. An electromagnetic coil(140) is adjacent to the support stand. A power supply part(160) heats conductive powder coated on the bump object. The electromagnetic coil is adjacent to the upper part of the bump object. [Reference numerals] (160a,160b) Power supply part