| 摘要 |
Semiconductor device modules having two or more integrated circuit dies mounted on opposing sides of a substrate. The integrated circuit dies are mounted by use of surface mount connections, such as flip chip connections implemented using conductive bumps. 5 Systems may include one or more of the present semiconductor device modules, and in some cases may also include other modules, such as a system module. 110a 22110b 200b 20a100 130 { 130 VVVV VVu .VVV VVVVVV VVVVVV VV VVVV VVV 200bor 3 100 110b 1)3 130 110a 210a 200a 210c 200c 130 110a 130 o 0 0 0 0 0 0 o 0 0 120a 120c o 0 0 0 0 0 0 0 0 0 0 0 io o o lo o o 0 o 0~l 0 o00 01 lo o o o10 o oi o l o0 0 lo o o ol lo o o ol 0 o 10 0 0 01 10 0 0 o o 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 |
