发明名称 |
SELF-ALIGNED FINE PITCH PERMANENT ON-CHIP INTERCONNECT STRUCTURES AND METHOD OF FABRICATION |
摘要 |
An interconnect structure and methods for making the same include sidewall portions of an interlevel dielectric layer. The sidewall portions have a width less than a minimum feature size for a given lithographic technology and the width is formed by a thickness of the interlevel dielectric layer when conformally formed on vertical surfaces of a mandrel. The sidewall portions form spaced-apart openings. Conductive structures fill the spaced-apart openings and are separated by the sidewall portions to form single damascene structures.
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申请公布号 |
US2013032949(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
US201213606788 |
申请日期 |
2012.09.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;LIN QINGHUANG;MEHTA SANJAY;SHOBHA HOSADURGA |
发明人 |
LIN QINGHUANG;MEHTA SANJAY;SHOBHA HOSADURGA |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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