HEAT TREATING DEVICE AND SUBSTRATE TRANSFER METHOD TO TRANSFER THE SUBSTRATE TO THE SAME

摘要

PURPOSE: A heat treatment apparatus and a method for transferring a substrate to the same are provided to increase the number of wafers processed in one process by loading or unloading a plurality of wafers on or from a wafer boat once. CONSTITUTION: A carrier(C) receives a plurality of wafers(W) processed in a heat treatment apparatus. A wafer boat(3) includes a ceiling plate(34), a bottom plate(35), and a pillar(36) which supports the ceiling plate from the bottom plate. A wafer transfer device(4) is installed between the wafer boat and an opening part of a partition. The wafer transfer device includes a fork(F) and a transfer device(5). A moving unit(45) simultaneously or independently moves a plurality of forks. [Reference numerals] (7) Control unit