| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide plasma processing equipment having reduced secular change in plasma processing performance by stabilizing a temperature of a sample table cover and a gas amount generated from the sample table cover. <P>SOLUTION: Plasma processing equipment comprises a sample table 207 disposed in a lower part in a vacuum vessel so as to face plasma, and having an upper face on which a sample W to be processed using the plasma is to be placed. The sample table 207 has: a recess portion arranged on an outer peripheral side of the face on which the sample W is to be placed, so as to have a level difference between itself and the face, and in which a dielectric ring-shaped member 301 is arranged; and means 315 arranged below the ring-shaped member 301, for heating the ring-shaped member 301. The sample table 207 includes: metal members 303 and 304 arranged on an outer peripheral side of the ring-shaped member 301 and above the member 301, and connected to the sample table 207, for positioning the ring-shaped member 301 by pressing the member 301 downward; and means 308 for supplying a heat transference gas to a gap between an upper face of the recess portion and a lower face of the ring-shaped member 301. <P>COPYRIGHT: (C)2013,JPO&INPIT |
