EPOXY RESIN COMPOSITION WITH EXCELLENT MOLDABILITY AND METAL COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD INCLUDING SAME

摘要

The present invention relates to: an epoxy resin composition which comprises (a) at least one epoxy resin selected from the group consisting of bisphenol A-, bisphenol F-, cresol novolac-, dicyclopentadiene-, trisphenylmethane-, naphthalene-, and biphenyl-type epoxy resins, and hydrogenated epoxy resin thereof, (b) a dimer acid -modified epoxy resin or a urethane-modified epoxy resin, (c) a curing agent, (d) a curing accelerator, and (e) an inorganic filler, wherein, based on 100 parts by weight of a mixture of the epoxy resin and the curing agent, the dimer acid -modified epoxy resin or the urethane-modified epoxy resin is included in the amount of 5-40 parts by weight, the curing accelerator is included in the amount of 0.005-0.05 parts by weight, and the inorganic filler is included in the amount of 200-400 parts by weight; and a metal copper clad laminate for a printed circuit board including an insulating layer formed using the epoxy resin composition.