| 摘要 |
<p>The invention relates to a halogen-free flame-retardant addition type organosilicon encapsulant for electronic appliances, which comprises the following components: A) vinyl silicone oil; B) silicon dioxide or alumina treated by silane; C) a compound, each molecule of which contains an H-Si functional group, wherein the mass content of H is 0.1 to 1.2%; D) hydrolysate of vinyltrimethoxysilane(triethoxysilane) and gamma-(2,3-glycidoxy)propyl trimethoxysilane(triethoxysilane); E) chloroplatinic acid or 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex; F) one or more selected from the group consisting of carbon black, iron black, titanium dioxide, cerium oxide, benzotriazole, zinc carbonate and magnesium carbonate. The matter prepared in this invention is halogen-free and flame-retardant, also with heat conduction and adhesion performance to a certain degree and is very applicable to encapsulate of electronic appliances.</p> |
