| 摘要 |
PURPOSE: An encapsulant with high barrier property is provided to sufficiently suppress penetration, thereby being capable of obtaining a sealant with high barrier property. CONSTITUTION: An encapsulant with high barrier property comprises a plate-like inorganic compound in a matrix polymer which is dispersed in a stacking shape. A sealant for an organic device is obtained by crosslinking a sealant composition. The matrix polymer is an epoxy resin, a modified epoxy resin, a polyurethane resin, a polycarbonate resin, a polyacrylate resin, a modified olefin resin, or a polyester resin. The average particle diameter of a plate-like inorganic compound measured by a microtrack method is 0.5-5 microns. The average value of the long diameter to the thickness ratio is 1.3-50. [Reference numerals] (AA,DD) Substrate; (BB) Present invention; (CC) Electrode·organic thin film |
