| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting electronic elements having a structure which prevents a brazing material between an insulation substrate and an aluminum circuit layer and a brazing material between the insulation substrate and an aluminum layer from rising and penetrating into the opposite surfaces. <P>SOLUTION: In a substrate for mounting electronic elements 1, an aluminum circuit layer 12, on which electronic elements are mounted, is brazed on one surface of an insulation substrate 11, and an aluminum layer 13 is brazed on the other surface. At least one of the aluminum circuit layer 12 and the aluminum layer 13 has a protruding part 20, which is formed by a joined surface joined with the insulation substrate 11 and extending to the exterior, in at least a part of its side surface in the circumferential direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
