| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is a small size, inhibits flapping of a frame on the semiconductor chip for control side, and improves the adhesiveness between a frame on which a semiconductor chip for electric power is mounted and an insulation sheet. <P>SOLUTION: A semiconductor device 1 comprises: a lead frame for a semiconductor chip for electric power 2a; the semiconductor chip for the electric power 4; an insulation sheet 8; a lead frame for a semiconductor chip for control 2c; the semiconductor chip for the control 5; a lead terminal for the semiconductor chip for the control 2d; a support member 7 disposed at the lower sides of the lead frame for the semiconductor chip for the control 2c and the lead terminal for the semiconductor chip for the control 2d; and a mold resin 9. The support member 7 is disposed around an upper region 6 of a juncture part 3 between the lead frame for the semiconductor chip for the electric power 2a and the insulation sheet 8. <P>COPYRIGHT: (C)2013,JPO&INPIT |
