| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state image pickup device capable of determining the interval and the number of plural connection conductors provided between the solid state image pickup element and a signal processing element to transmit pixel signals without being restricted by designing rules on a package substrate. <P>SOLUTION: A solid state image pickup device 16 is configured including: a solid state image pickup element 1 having plural pixel signal output terminals; a signal processing element 6 having plural pixel signal input terminals; a substrate 23 having the solid state image pickup element 1 and the signal processing element 6 disposed on the upper surface, and having wirings on the upper surface and an inner layer; and metal wires 32 that are connection conductors to transmit pixel signals between the solid state image pickup element 1 and the signal processing element 6. Since the pixel signals from the solid state image pickup element 1 are directly input to the circuit of the signal processing element 6 without passing through wirings on the package substrate, many metal wires 32 can be disposed at a small pitch without being restricted by the designing rules of the package substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
