| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate which can form a circuit pattern at a favorable fine pitch, and to provide a printed wiring board using the same. <P>SOLUTION: In the laminate including a plated copper layer on which a surface-treated layer is formed, the surface-treated layer contains one or more kinds of Au, Pd, Pt and Mo, and when one or more elements of Au, Pd, Pt and Mo and the density distribution of oxygen in the depth direction are measured, a distance Xnm from a surface layer at which the atom density of one or more kinds of Au, Pd, Pt and Mo becomes maximum and a distance Ynm from a surface layer at which the atom density of oxygen becomes maximum satisfy Y≤X. <P>COPYRIGHT: (C)2013,JPO&INPIT |
