| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin mold type semiconductor module which improves the heat radiation performance of a heat sink and inhibits the adhesive failure caused between the heat sink and a mold when a resin based material is molded, and thereby contributing to improvement of the yield. <P>SOLUTION: A resin mold type semiconductor module of this invention includes: a lead frame; a semiconductor element mounted on a surface of the lead frame; a heat sink which has an adhesion part adhered to a rear surface of the lead frame and located at the one surface side and an irregularity part for heat radiation located on the other surface side; and a mold resin covering the lead frame, the semiconductor element, and the heat sink with at least the irregularity part of the heat sink exposed and integrally molding those components. Flat parts or protruding parts, which tightly contact with a mold, are provided at an area around the irregularity part and at a part of the irregularity part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
