发明名称 DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an amorphous carbon film having high etching resistance. <P>SOLUTION: A deposition method comprises the steps of: arranging a substrate on a lower electrode by using a parallel plate plasma CVD apparatus in which an upper electrode and the lower electrode are provided in a processing container; and supplying a carbon monoxide and an inert gas in the processing container, and decomposing the carbon monoxide by applying a high frequency power to at least the upper electrode and generating plasma to accumulate and deposit amorphous carbon on a substrate. It is preferred that the upper electrode is a carbon electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030801(A) 申请公布日期 2013.02.07
申请号 JP20120225119 申请日期 2012.10.10
申请人 TOKYO ELECTRON LTD 发明人 ISHIKAWA HIROSHI;MURAI TADAKAZU;MORIZAKI EISUKE
分类号 H01L21/31;C23C16/26;H01L21/027 主分类号 H01L21/31
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