| 摘要 |
The invention relates to a structural device (1) comprising a supporting body (2) on which a structural element (3) consisting of a film (4) and at least one component (5, 6, 7) is arranged, wherein the supporting body (2) is formed from a carrier substrate (11) having a cutout (10). The invention also relates to an apparatus for applying the structural element (3), comprising a receptacle for a plurality of structural devices (1) which are individual or connected to one another in a row, an advancing device for conveying the structural devices (1) and a tool for separating the structural element (3) from the supporting body (2) and/or for arranging the structural element (3) at an application point (16). The invention furthermore relates to a method for producing the structural device (1) from at least one component (5, 6, 7) and structural element (3) consisting of a film (4), in which a carrier substrate (11) is provided and, in any desired sequence, at least one layer (8, 9) of the film (4) and at least one component (5, 6, 7) are applied to the carrier substrate (11), wherein the carrier substrate (11) is then structured and completely removed in portions up to the film (4) in a useful region and remains in a supporting zone delimiting the useful region so as to form a supporting body (2). The invention also relates to a method for applying the structural element (3), wherein the structural element (3) is released from the supporting body (2) and is arranged at the application point (16). |
