| 摘要 |
An intelligent power module is provided to improve durability and reliability of the module by forming lead frames on a printed circuit board through etching. An intelligent power module includes a mold(100), a printed circuit board(200) and lead frames(320). The mold configures the whole appearance of the module, and is formed in the printed circuit board and lead frames through injection molding. Plural semiconductor devices are mounted on both surfaces of the printed circuit board, in which the devices are connected to each other via a circuit pattern. The lead frames are adapted to connect the printed circuit board with an external component so that a signal is input or output in or from the printed circuit board. |
