| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the heat dissipation efficiency of a printed circuit board by forming buried via holes inside an insulation layer. CONSTITUTION: First and second insulation layers(120,125) are formed of a thermosetting or thermoplastic polymer substrate, a ceramic substrate, or an organic-inorganic composite substrate. A core insulating layer is composed of the first and second insulation layers laminated. Via holes(115) and an internal circuit layer(111) are formed in the core insulating layer. The via holes include a first part(115a) formed of copper-containing alloy, a second part(115b) buried in the second insulation layer, and a third part formed between the first and second parts. The internal circuit layer is formed on the second insulation layer. An external circuit layer including via pads(135,145) connected to the via holes and a circuit pattern(131) is formed on the top of the first and second insulation layers. |
