| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve yield of a semiconductor product by suppressing variation in bonding strength between a semiconductor device and a substrate. <P>SOLUTION: A method of manufacturing a semiconductor apparatus includes the steps of: providing a semiconductor device 1, a substrate 2 containing Cu as a main element at least in a surface, and a ZnAl eutectic solder chip 3' having a shape smaller than the semiconductor device, respectively; interposing the ZnAl eutectic solder chip between the substrate and the semiconductor device by arranging the semiconductor device and the substrate to face respective bonding surfaces each other; heating the ZnAl eutectic solder chip interposed between the substrate and the semiconductor device while applying a load 31, thereby forming a ZnAl solder layer 3 by melting the ZnAl eutectic solder chip; and cooling the ZnAl solder layer while applying the load thereto. <P>COPYRIGHT: (C)2013,JPO&INPIT |
