THERMOPLASTIC RESIN COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having an extremely high coefficient of thermal conductivity compared with general-purpose plastics, yet having excellent extrusion moldability and blow moldability.

SOLUTION: The thermoplastic resin composition having high thermal conductivity comprises: a thermoplastic polyester resin; a polycarbonate resin if necessary; an inorganic compound having high thermal conductivity and exhibiting a coefficient of thermal conductivity of 5 W/m K or more as a single substance; and at least one organic compound selected from the group consisting of compounds and their acid anhydrides having three or more carboxyl groups or ester-forming derivative groups thereof in the molecule. The at least one organic compound selected from the group consisting of compounds and their acid anhydrides having three or more carboxyl groups or ester-forming derivative groups thereof in the molecule is preferably an aromatic polyvalent carboxylic acid anhydride having two or more acid anhydride groups in the molecule.

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