发明名称 WIRING CONNECTION TOOL BETWEEN SUBSTRATES, DEVICE HAVING WIRING STRUCTURE, AND CHASSIS TYPE SWITCH
摘要 <P>PROBLEM TO BE SOLVED: To avoid increase of the number of substrate layers for insulating wirings crossing with each other. <P>SOLUTION: A wiring connection tool between substrates electrically connects a plurality of first wirings formed on a first substrate to a plurality of second wirings formed on a second substrate and paired with the plural first wirings. The wiring connection tool comprises plural sets including first connection parts, second connection parts and intermediate parts electrically connecting the first connection parts and the second connection parts corresponding to the plural pairs, respectively. The plural sets are mutually insulated. In the wiring connection tool, when the first substrate is physically connected to the second substrate, each first connection part is electrically connected to corresponding one of the plural first wirings, and each second connection part is electrically connected to one of the plural second wirings paired with one of the plural first wirings. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030314(A) 申请公布日期 2013.02.07
申请号 JP20110164248 申请日期 2011.07.27
申请人 FUJITSU LTD 发明人 MIYAZAKI TAKEHIDE;IMABAYASHI HIROBUMI
分类号 H01R12/58;H01R12/71;H05K1/14 主分类号 H01R12/58
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