| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of improving substrate transfer efficiency. <P>SOLUTION: A heat treatment apparatus includes: a container placement part on which a substrate container for accommodating a plurality of substrates is placed so that the plurality of substrates are overlapped one another at a first interval; a substrate holder which holds the plurality of substrates so that the plurality of substrates are overlapped one another at a second interval narrower than the first interval; a substrate transfer part which includes at least two substrate support parts capable of supporting the substrates and transfers the plurality of substrates between the substrate holder and the substrate container, in which the at least two substrate support parts are arranged so as to overlap one another at the first interval, advance/retreat together with respect to the substrate container and advance/retreat independently with respect to the substrate holder; and a control part which controls the upper substrate support part of the at least two substrate support parts so that the upper substrate support part does not operate when the lower substrate support part supports the substrates. <P>COPYRIGHT: (C)2013,JPO&INPIT |
