发明名称 MULTILAYER WIRING BOARD AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of forming an area in which the distortion generated between fiber layers constituting each insulator layer; and an electronic apparatus. <P>SOLUTION: A multilayer wiring board comprises: a first insulator layer 21 in which a plurality of fibers are woven in a predetermined repeat pattern and a resin is impregnated and formed in a plate shape; a second insulator layer 22 in which a plurality of fibers are woven in a predetermined repeat pattern and a resin is impregnated and formed in a plate shape, and a resin layer 23 which bonds the first insulator layer 21 to the second insulator layer 22. The repeat pattern of the first insulator layer 21 and the repeat pattern of the second insulator layer 22 are arranged so as to be the same in direction, and the position of the repeat pattern of the first insulator layer 21 and the position of the repeat pattern of the second insulator layer 22 are shifted by a predetermined distance. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030560(A) 申请公布日期 2013.02.07
申请号 JP20110164652 申请日期 2011.07.27
申请人 YASKAWA ELECTRIC CORP;YOKOHAMA NATIONAL UNIV 发明人 TAKENAKA KUNIHIRO;YU JIANG
分类号 H05K3/46 主分类号 H05K3/46
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