| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for printed wiring board, capable of achieving high fine wiring formability even in use of a thin metal film layer to a degree that generation of pinholes become obvious. <P>SOLUTION: A support layer, a thin metal film layer, a specific hardened resin composition layer, and an inner layer circuit board are constructed in order. An insulated layer that is a hardened material of the hardened resin composition layer is filled with specific etching rate in a desmear process. <P>COPYRIGHT: (C)2013,JPO&INPIT |
