发明名称 THERMOFORMING DEVICE AND FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermoforming device and forming method, capable of efficiently and continuously performing thermoforming at a high speed, in which a shaping body is heated at a high speed or subjected to a cooling stroke in a process from the shaping of thermoforming to mold release, in particular, the mold release is performed by performing heat treatment at a high temperature equal to or more than a preheated sheet temperature before the shaping. <P>SOLUTION: In this thermoforming device allowing pressure forming by a pressure forming box mechanism of a resin sheet 112, a cooling means 40 is disposed in the vicinity of a mold 60. The cooling means is retreated relative to an upper part of the mold after the separation of a pressure forming box mechanism body from the mold or the mold is configured to be capable of advancing to and retreating from a lower part of the cooling means so that the shaping body of the resin sheet is cooled by jetting a cooling medium. Further, as the mold, one including a surface layer 61 comprising a material having a heat penetration rate (kJ/m2s1/2K) of 0.01-15 and a means in contact with the back of the surface layer and adjusting the entire development surface of the layer to a steady uniform temperature is used to constitute a molding apparatus for a thermoplastic resin sheet. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013028046(A) 申请公布日期 2013.02.07
申请号 JP20110165067 申请日期 2011.07.28
申请人 FUKUMURA MIKIO 发明人 FUKUMURA MIKIO
分类号 B29C51/42;B29C51/10 主分类号 B29C51/42
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