发明名称 |
THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate. |
申请公布号 |
US2013032384(A1) |
申请公布日期 |
2013.02.07 |
申请号 |
US201213565249 |
申请日期 |
2012.08.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;YOO WON HEE;CHANG BYEUNG GYU;LEE TAEK JUNG;PARK YUN HWI |
发明人 |
YOO WON HEE;CHANG BYEUNG GYU;LEE TAEK JUNG;PARK YUN HWI |
分类号 |
H05K1/03;H05K3/22 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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