| 摘要 |
PURPOSE: A light emitting element inspecting method is provided to perform both an electric inspecting process and an optical inspecting process for a plurality of light emitting elements on a wafer. CONSTITUTION: A wafer is loaded on a first chuck(S110). One of an electric inspecting process and an optical inspecting process is selectively performed for light emitting elements of the wafer(S130). The wafer is loaded on a second chuck(S140). The other one of the electric inspecting process and the optical inspecting process is performed for the light emitting elements(S160). [Reference numerals] (AA) Start; (BB) End; (S100) Supplying wafers to a cassette; (S110) Loading a first wafer on a first chuck; (S120) Aligning the first wafer on a first probe card; (S130) Performing the electrical inspection of the first wafer; (S140) Loading the first wafer on a second chuck; (S150) Aligning the first wafer on a second probe card; (S160) Performing the optical inspection of the first wafer; (S170) Transferring the first wafer to the cassette |
