| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, a flexible wiring board and the like achieving improvement in insulating property, folding durability, resolution, plating durability and flame retardancy, as well as suppressing warpage during curing by heat and generation of surface tack without decreasing the glass transition temperature of a resin. <P>SOLUTION: The photosensitive composition comprises an acid-modified polyurethane resin containing an ethylenically unsaturated group and an epoxy-based heat-crosslinking agent having at least two epoxy groups, in which the epoxy-based heat-crosslinking agent has a partial structure of a glycidyloxybenzene ring and the epoxy-based heat-crosslinking agent has an epoxy equivalent of more than 300 g/eq. There are also provided a photosensitive dry film, a photosensitive laminate, a flexible wiring board, a method for manufacturing a flexible wiring board and a method for forming a permanent pattern. <P>COPYRIGHT: (C)2013,JPO&INPIT |
