| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in wet spreading property and bleeding property after chip mounting, with heat conductivity being excellent, and to provide a semiconductor device which is excellent in reliability and heat conductivity when the resin composition is used as an adhesive for a heat radiation member or a die attachment member to the semiconductor. <P>SOLUTION: The liquid resin composition contains: (A) a compound containing a functional group capable of radical polymerization; and (B) a heat conductive filler which is non-conductive. Here, the average particle size of (B) is 2-15 um, the content of (B) is 32.5-47.5 vol%, and a thixotropy ratio of 0.5 rpm and 5.0 rpm of the liquid resin composition at that time provided by Brookfield viscosity meter is 1 to 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
